Modelling of spontaneous adhesion phenomena in Micro-Electro-Mechanical Systems

DOI10.1016/j.euromechsol.2012.11.008zbMath1348.74109OpenAlexW2046543472MaRDI QIDQ335195

Attilio Frangi, Raffaele Ardito, Alberto Corigliano

Publication date: 2 November 2016

Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.euromechsol.2012.11.008

zbMATH Keywords

capillary forcesrough surfacesMEMSFE simulationsmicro-systemsspontaneous adhesionstictionVan der Waals forces

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Electromagnetic effects in solid mechanics (74F15)

Related Items (7)

Modelling of spontaneous adhesion phenomena in Micro-Electro-Mechanical Systems ⋮ Evaluation of adhesion in microsystems using equivalent rough surfaces modeled with spherical caps ⋮ Fluid flow and heat transfer of non-Newtonian nanofluid in a microtube considering slip velocity and temperature jump boundary conditions ⋮ Numerical solution of the Duffing equation with random coefficients ⋮ Experimental evaluation and numerical modeling of adhesion phenomena in polysilicon MEMS ⋮ A probabilistic model for predicting the uncertainties of the humid stiction phenomenon on hard materials ⋮ Adhesive contact behavior between piezoelectric and elastic materials with a mismatch strain

Uses Software

• Gmsh

Cites Work

• Modelling of spontaneous adhesion phenomena in Micro-Electro-Mechanical Systems
• Deformation of silicon - insights from microcompression testing at 25-500\(^\circ \)C
• Multi-scale approach for frictional contact of elastomers on rough rigid surfaces
• Formulation and analysis of a three-dimensional finite element implementation for adhesive contact at the nanoscale
• On the geometry of slip and spin in finite plastic deformation
• Adhesion of micro-cantilevers subjected to mechanical point loading: modeling and experiments.
• Gmsh: A 3-D finite element mesh generator with built-in pre- and post-processing facilities

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