A Cracked Piezoelectric Material Strip Under Transient Thermal Loading

DOI10.1115/1.1429935zbMath1110.74736OpenAlexW2060446155WikidataQ61505894 ScholiaQ61505894MaRDI QIDQ3443756

No author found.

Publication date: 1 June 2007

Published in: Journal of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1115/1.1429935

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

Related Items (7)

An opening crack model for thermopiezoelectric solids ⋮ Dynamic response of a cracked thermopiezoelectric strip under thermoelectric loading using fractional heat conduction ⋮ Fracture analysis of Griffith interface crack in fine-grained piezoelectric coating/substrate under thermal loading ⋮ A cracked functionally graded piezoelectric material strip under transient thermal loading ⋮ Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors ⋮ Fractional single-phase lag heat conduction and transient thermal fracture in cracked viscoelastic materials ⋮ Interface crack problem of functionally graded piezoelectric materials: effects of the position of electromechanical impact and gradient

This page was built for publication: A Cracked Piezoelectric Material Strip Under Transient Thermal Loading