Mechanics of direct wafer bonding

DOI10.1098/RSPA.2005.1571zbMath1149.74374OpenAlexW2127617591MaRDI QIDQ3503249

K. T. Turner, S. M. Spearing

Publication date: 22 May 2008

Published in: Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1098/rspa.2005.1571

zbMATH Keywords

surface forcesadhesionwafer bondingJKR

Mathematics Subject Classification ID

Contact in solid mechanics (74M15) Brittle fracture (74R10)

Related Items (1)

Adhesion and delamination boundary conditions for elastic plates with arbitrary contact shape

Cites Work

• A finite element model for delamination propagation in composites

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