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FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH - MaRDI portal

FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH

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Publication:3556846

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DOI10.1142/S0217979210064101zbMath1186.82095OpenAlexW1976300558MaRDI QIDQ3556846

Azman Jalar, Mohamad Faizal Abdullah, Mohd Faridz Mod Yunoh, Che Ku Eddy Nizwan, Shahrum Abdullah, Ahmad Kamal Ariffin

Publication date: 26 April 2010

Published in: International Journal of Modern Physics B (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1142/s0217979210064101

zbMATH Keywords

durability oxidised leadframe quad flat no-lead three-points cyclic bending test un-oxidised leadframe

Mathematics Subject Classification ID

Statistical mechanics of semiconductors (82D37) Numerical methods for discrete and fast Fourier transforms (65T50)

Cites Work

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