Estimation of thermal resistance distributions for die-attach testing in microelectronics

DOI10.1080/17415970701198431zbMath1157.80392OpenAlexW2033327215MaRDI QIDQ3604084

V. Feuillet, Yves Scudeller, Yvon Jarny

Publication date: 24 February 2009

Published in: Inverse Problems in Science and Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1080/17415970701198431

zbMATH Keywords

Defect detectionDistribution estimationInverse heat conductionMicroelectronics

Mathematics Subject Classification ID

Inverse problems in thermodynamics and heat transfer (80A23)

Cites Work

• Refinement and coarsening indicators for adaptive parametrization: application to the estimation of hydraulic transmissivities
• A Multiresolution Method for Distributed Parameter Estimation

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