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Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models - MaRDI portal

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Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models

From MaRDI portal
Publication:3605175

DOI10.1002/JNM.694zbMATH Open1419.74105OpenAlexW4256202932MaRDI QIDQ3605175

Author name not available (Why is that?)

Publication date: 20 February 2009

Published in: (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1002/jnm.694



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