Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws

DOI10.1007/S10409-008-0193-7zbMath1270.74174OpenAlexW2093461248WikidataQ61503394 ScholiaQ61503394MaRDI QIDQ361949

Hongyuan Liu, Bin Gu, Yiu-Wing Mai, Shou Wen Yu, Xi Qiao Feng

Publication date: 20 August 2013

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-008-0193-7

zbMATH Keywords

fracture mechanicsstress intensity factorinterfacial defectsmart-cut technology

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent
• Mechanics of Smart-Cut technology
• Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts

This page was built for publication: Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws