Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate
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Publication:363052
DOI10.1007/S00419-009-0315-0zbMath1271.74387OpenAlexW2070932767MaRDI QIDQ363052
Publication date: 30 August 2013
Published in: Archive of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00419-009-0315-0
singular integral equationsubstrateFGPMGauss-Chebyshev techniqueimpermeable and permeable crackssurface layer
Brittle fracture (74R10) Inhomogeneity in solid mechanics (74E05) Electromagnetic effects in solid mechanics (74F15)
Related Items (3)
Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties ⋮ An interface crack moving between magnetoelectroelastic and functionally graded elastic layers ⋮ Non-local behavior of two collinear mixed-mode limited-permeable cracks in a functionally graded piezoelectric medium
Cites Work
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- Closed-form solution for a mode-III crack at the mid-plane of a piezoelectric layer
- Mode III crack problems for two bonded functionally graded piezoelectric materials
- Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively
- Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
- A Mode III Crack in a Functionally Graded Piezoelectric Material Strip
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