Improved tri-layered interfacial stress model with the effect of different temperatures in the layers

DOI10.1007/S00419-010-0437-4zbMath1271.74055OpenAlexW2041110856MaRDI QIDQ363442

M. V. V. Murthy, K. N. Seetharamu, D. Sujan

Publication date: 2 September 2013

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-010-0437-4

zbMATH Keywords

electronic packagingdifferent uniform temperature modelexponent parameterlinear temperature gradientpeeling stressshearing stresstri-layered model

Mathematics Subject Classification ID

Composite and mixture properties (74E30) Thermal effects in solid mechanics (74F05)

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