Thermal stress intensity factors for an interface crack in a functionally graded layered structures

DOI10.1007/s00419-010-0433-8zbMath1271.74389OpenAlexW2043370272MaRDI QIDQ363630

Sheng-Hu Ding, Xing Li

Publication date: 3 September 2013

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-010-0433-8

zbMATH Keywords

functionally graded layered structure (FGLS)thermal resistancethermal stress intensity factors (TSIFs)

Mathematics Subject Classification ID

Brittle fracture (74R10) Inhomogeneity in solid mechanics (74E05) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05)

Related Items (5)

Thermal stresses factors of orthotropic graded layers with a finite line bond ⋮ Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer ⋮ Fracture analysis of a nonhomogeneous coating/substrate system with an interface under thermal shock ⋮ Thermoelastic analysis of nonhomogeneous structural materials with an interface crack under uniform heat flow ⋮ Thermal shock fracture of a crack in a functionally gradient half-space based on the memory-dependent heat conduction model

Cites Work

• Thermal shock analysis for a functionally graded plate with a surface crack
• An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
• The Crack Problem for a Nonhomogeneous Plane
• The Surface Crack Problem for a Plate With Functionally Graded Properties

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