Three-dimensional simulation of underfill process in flip-chip encapsulation

DOI10.1016/j.compfluid.2010.12.030zbMath1271.76080OpenAlexW2042256288MaRDI QIDQ365295

Kai Xu, Yun Zhang, Hui Wang, De-Qun Li, Hua-min Zhou

Publication date: 4 September 2013

Published in: Computers and Fluids (Search for Journal in Brave)

Full work available at URL: http://www.sciencedirect.com/science/article/pii/S0045793011000028

zbMATH Keywords

simulationthree-dimensionalfluid flowunderfillcapillary action

Mathematics Subject Classification ID

Cites Work

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