Configurational forces and the application to dynamic fracture in electroelastic medium
From MaRDI portal
Publication:373294
DOI10.1007/S10704-010-9464-YzbMath1273.74448OpenAlexW2066139541MaRDI QIDQ373294
Hongjun Yu, Qi-Lin He, Lin-Zhi Wu, Ming Li
Publication date: 22 October 2013
Published in: International Journal of Fracture (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10704-010-9464-y
Cites Work
- Approaches to dynamic fracture modelling at finite deformations
- A J-integral for the analysis of electrically induced mechanical stress at cracks in elastic dielectrics
- Crack driving force and energy-momentum tensor in electroelastodynamic fracture
- Conservation laws and the material momentum tensor for the elastic dielectric
- The elastic energy-momentum tensor
- Energy-release rates and path-independent integrals in electroelastic crack propagation
- On the universality of the thermomechanics of forces driving singular sets
- Configurational forces and the basic laws for crack propagation.
- Application of material forces to hyperelastostatic fracture mechanics. I: Continuum mechanical setting
- The nature of configurational forces
- The thermoelastic material-momentum equation
- Crack tip shielding or anti-shielding due to smooth and discontinuous material inhomogeneities
- Configuration forces as basic concepts of continuum physics
- Configurational forces and a constitutive theory for crack propagation that allows for kinking and curving
- On Cauchy's equations of motion
- Crack Extension Force in a Piezoelectric Material
- The electroelastic energy–momentum tensor
- Impermeable Crack and Permeable Crack Assumptions, Which One is More Realistic?
- On the configurational force balance in thermomechanics
- Mechanics in Material Space
- Energy Release Rates and Related Balance Laws in Linear Elastic Defect Mechanics
- ON THE DYNAMIC FRACTURE OF PIEZOELECTRIC MATERIALS
- The force on an elastic singularity
This page was built for publication: Configurational forces and the application to dynamic fracture in electroelastic medium