Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

DOI10.1007/S10704-009-9348-1zbMath1273.74112OpenAlexW1998408691MaRDI QIDQ373408

Mohammad Hasan, H. S. Yoon

Publication date: 22 October 2013

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-009-9348-1

zbMATH Keywords

contactinterface fracturecomplex stress intensity factorelectronic packageinner pressurethree-dimensional cracksvirtual crack closure technique

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70) Finite element methods applied to problems in solid mechanics (74S05)

Related Items (3)

Elastic interaction of interfacial spherical-cap cracks in hollow particle filled composites ⋮ Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings ⋮ Analysis of fatigue delamination growth in flip-chip package

Cites Work

• Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique
• Analysis of three-dimensional interface cracks using enriched finite element
• The use of finite extension strain energy release rates in fracture of interfacial cracks
• Finite element calculation of stress intensity factors for interfacial crack using virtual crack closure integral
• The Interface Crack Under Combined Loading
• Stress intensity factors for three-dimensional surface cracks using enriched finite elements
• Generalization of the grippith-sneddon criterion for the case of a nonhomogeneous body

This page was built for publication: Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique