Thermal stresses factors of orthotropic graded layers with a finite line bond

DOI10.1007/s00419-013-0728-7zbMath1293.74078OpenAlexW2034882093MaRDI QIDQ398158

Junqiao Liu, Peiyuan Liu, Xing Li

Publication date: 12 August 2014

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-013-0728-7

zbMATH Keywords

singular integral equationsthermal stress intensity factors (TSIFs)finite line bondorthotropic functionally graded layer

Mathematics Subject Classification ID

Anisotropy in solid mechanics (74E10) Stress concentrations, singularities in solid mechanics (74G70) Composite and mixture properties (74E30) Thermal effects in solid mechanics (74F05)

Related Items (2)

Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer ⋮ Thermoelastic closed-form solutions of FGM plates subjected to temperature change in longitudinal and thickness directions

Cites Work

• Thermal stress intensity factors for an interface crack in a functionally graded layered structures
• A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply
• Interface crack in a nonhomogeneous elastic medium
• Determination of thermal stress intensity factors for an interface crack in a graded orthotropic coating-substrate structure
• The Crack Problem in Bonded Nonhomogeneous Materials
• The Surface Crack Problem for a Plate With Functionally Graded Properties

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