Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates

DOI10.1007/S10409-012-0140-5zbMath1293.74058OpenAlexW2109891651MaRDI QIDQ399557

Lu-Ming Shen

Publication date: 19 August 2014

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-012-0140-5

zbMATH Keywords

grain sizegrain boundariesmolecular dynamicsuniaxial stresshigh strain ratesnanocrystalline Cuuniaxial strain

Mathematics Subject Classification ID

Crystalline structure (74E15)

Related Items (1)

Effect of special rotational deformation on dislocation emission from interface collinear crack tip in nanocrystalline bi-materials

Uses Software

• VMD

Cites Work

• Investigating the deformation of nanocrystalline copper with microscale kinematic metrics and molecular dynamics
• A study of mechanical properties of pure and nitrogen-doped ultrananocrystalline diamond films under various loading conditions
• The loading history and crystal orientation effects on the size-dependency of single crystal diamond properties
• Fast parallel algorithms for short-range molecular dynamics
• A multi-scale simulation of tungsten film delamination from silicon substrate

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