The Mode III Crack Problem in Bonded Materials With a Nonhomogeneous Interfacial Zone
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Publication:4019544
DOI10.1115/1.2897202zbMath0756.73069OpenAlexW2049376733MaRDI QIDQ4019544
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Publication date: 16 January 1993
Published in: Journal of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1115/1.2897202
shear modulussubcritical crack growthasymptotic stress fieldnonhomogeneous striphomogeneous half planespiecewise homogeneous materials
Related Items (14)
Fracture analysis of functionally graded coatings: antiplane deformation. ⋮ Dynamic investigation of a functionally graded layered structure with a crack crossing the interface ⋮ Mode III crack problems of two bonded functionally graded strips with internal cracks ⋮ Stress intensity factors for an oblique edge crack in a coating/substrate system with a graded interfacial zone under antiplane shear ⋮ Periodic cracking of functionally graded coatings ⋮ Mode-I crack problem for functionally graded layered structures ⋮ Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface ⋮ Stress wave scattering induced by a mode III interfacial crack in nonhomogeneous strips ⋮ Determination of the asymptotic crack tip fields for a crack perpendicular to an interface between elastic-plastic materials ⋮ Analytical solution for an interfacial crack subjected to dynamic anti-plane shear loading ⋮ Two mode III internal cracks located within two bonded functionally graded piezoelectric half-planes respectively ⋮ The collinear crack problem for an orthotropic functionally graded coating-substrate structure ⋮ Antiplane internal crack normal to the edge of a functionally graded piezoelectric/piezomagnetic half-plane ⋮ Antiplane shear crack problem in bonded materials with a graded interfacial zone
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