Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate

DOI10.1007/s00707-013-1084-yzbMath1302.74106OpenAlexW2033749652MaRDI QIDQ405037

J. Herrera, H. S. Yoon

Publication date: 4 September 2014

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-013-1084-y

Mathematics Subject Classification ID

Structured surfaces and interfaces, coexistent phases (74A50) Thin films (74K35)

Related Items

The effect of material anisotropy on the mechanics of a thin-film/substrate system under mechanical and thermal loads

Cites Work

• Asymptotic analysis of cracks in the adhesive layer of an orthotropic sandwich structure
• The edge cracking and decohesion of thin films
• Application of an orthotropy rescaling method to edge cracks and kinked cracks in orthotropic two-dimensional solids
• Elastostatic analysis of edge cracked orthotropic strips
• Dependence of stress on elastic constants in an anisotropic bimaterial under plane deformation; and the interfacial crack
• The asymptotic structure of small-scale yielding interfacial free-edge joint and crack-tip fields
• Mode II Edge Delamination of Compressed Thin Films
• Singularities, interfaces and cracks in dissimilar anisotropic media
• Mixed Mode Cracking in Layered Materials