Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging

DOI10.1016/j.compfluid.2007.07.007zbMath1237.76104OpenAlexW2034871612MaRDI QIDQ416551

Nobuyuki Satofuka, Tomohisa Hashimoto, Tanifuji Shin-Ichiro, Koji Morinishi

Publication date: 10 May 2012

Published in: Computers and Fluids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.compfluid.2007.07.007

Mathematics Subject Classification ID

Navier-Stokes equations for incompressible viscous fluids (76D05) Finite difference methods applied to problems in fluid mechanics (76M20) Capillarity (surface tension) for incompressible viscous fluids (76D45)

Related Items

Three-dimensional simulation of underfill process in flip-chip encapsulation, Computation of Two-phase Flow in Flip-chip Packaging Using Level Set Method

Cites Work

• A continuum method for modeling surface tension
• A level set approach for computing solutions to incompressible two-phase flow
• Upwind differencing scheme for the time-accurate incompressible Navier-Stokes equations
• Numerical Analysis of Particle Behavior Penetrating into Liquid by Level Set Method