Solder joint lifetime assessment of electronic devices

DOI<link itemprop=identifier href="https://doi.org/10.1002/(SICI)1097-0207(19980130)41:2<211::AID-NME265>3.0.CO;2-A" /><211::AID-NME265>3.0.CO;2-A 10.1002/(SICI)1097-0207(19980130)41:2<211::AID-NME265>3.0.CO;2-AzbMath0908.73075OpenAlexW2050699919MaRDI QIDQ4398054

Klaus Heiduschke

Publication date: 22 March 1999

Full work available at URL: https://doi.org/10.1002/(sici)1097-0207(19980130)41:2<211::aid-nme265>3.0.co;2-a

zbMATH Keywords

large strainscreep damage evolutioneutectic tin-lead soldereutectic tin-silver solderHencky strain-space descriptionnonlinear triangular finite elementsthermal cycling conditions

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Fracture and damage (74R99) Linear constitutive equations for materials with memory (74D05) Plastic materials, materials of stress-rate and internal-variable type (74C99) Nonlinear constitutive equations for materials with memory (74D10)

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Generalized strain space formulations and eigenprojection tensors

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