Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis

DOI10.1016/J.JMPS.2010.02.004zbMath1244.74054OpenAlexW2146776983MaRDI QIDQ442005

W. T. S. Huck, R. K. Annabattula, Patrick R. Onck

Publication date: 8 August 2012

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.jmps.2010.02.004

zbMATH Keywords

finite element analysisthin filmsbuckle-driven delaminationmicro/nano-fluidic channelsrelease-and-Bond-back

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Bifurcation and buckling (74G60) Thin films (74K35)

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Cites Work

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• Beam theory models for thin film segments cohesively bonded to an elastic half space
• The morphology and folding patterns of buckling-driven thin-film blisters
• Mixed Mode Cracking in Layered Materials

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