Wafer bin map recognition using a neural network approach

DOI10.1080/00207540210122275zbMath1051.90508OpenAlexW2078897728MaRDI QIDQ4468872

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Publication date: 11 June 2004

Published in: International Journal of Production Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1080/00207540210122275

zbMATH Keywords

defects

Mathematics Subject Classification ID

Production models (90B30) Case-oriented studies in operations research (90B90)

Related Items (1)

Automatic identification of spatial defect patterns for semiconductor manufacturing

Cites Work

• Detecting Spatial Effects from Factorial Experiments: An Application from Integrated-Circuit Manufacturing
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