Effect of processor layout on the thermal performance of fully immersed liquid-cooled microelectronics
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Publication:4597043
DOI10.2495/HT160131zbMath1378.80001WikidataQ59892375 ScholiaQ59892375MaRDI QIDQ4597043
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Publication date: 11 December 2017
Published in: Heat Transfer XIV: Simulation and Experiments in Heat Transfer and its Applications (Search for Journal in Brave)
Flows in porous media; filtration; seepage (76S05) Stokes and related (Oseen, etc.) flows (76D07) Free convection (76R10)
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