Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization

DOI10.1002/ASMB.2185zbMath1431.74099OpenAlexW2467749791MaRDI QIDQ4620158

Kijung Kim, Dong-Hee Lee, Kangchun Lee, Kwang-Jae Kim, Jihoon Seo

Publication date: 8 February 2019

Published in: Applied Stochastic Models in Business and Industry (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1002/asmb.2185

zbMATH Keywords

semiconductorslurrymulti-response surface optimizationCMPdual response surface optimization

Mathematics Subject Classification ID

Optimization of other properties in solid mechanics (74P10)

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