Analysis of fatigue delamination growth in flip-chip package

DOI10.1007/S00707-014-1201-6zbMath1302.74149OpenAlexW2066344547MaRDI QIDQ478321

Yong-Cai Geng, Sumit K. Garg

Publication date: 3 December 2014

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-014-1201-6

Mathematics Subject Classification ID

Anelastic fracture and damage (74R20)

Uses Software

• Unnamed Item

Cites Work

• Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

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