Analysis of Stress-Driven Grain Boundary Diffusion. Part I
From MaRDI portal
Publication:4830611
DOI10.1137/S0036139903438235zbMath1060.35143OpenAlexW2147793598MaRDI QIDQ4830611
Jon Wilkening, Len Borucki, James A. Sethian
Publication date: 13 December 2004
Published in: SIAM Journal on Applied Mathematics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1137/s0036139903438235
junctionsstress tensorsemigroup theoryLamé equationsstress singularitiesinterface boundary conditionsDirichlet-to-Neumann mapelectromigrationmass transport in microelectronic circuits
Lua error in Module:PublicationMSCList at line 37: attempt to index local 'msc_result' (a nil value).
Related Items (2)
A numerical model of stress driven grain boundary diffusion. ⋮ Recoverable creep deformation and transient local stress concentration due to heterogeneous grain-boundary diffusion and sliding in polycrystalline solids
This page was built for publication: Analysis of Stress-Driven Grain Boundary Diffusion. Part I