EFFICIENT SIMULATION OF 3‐D STRESS DISTRIBUTIONS AT TRENCH STRUCTURES CAUSED BY THERMAL MISMATCH OF TRENCH FILLING AND SILICON SUBSTRATE

DOI10.1108/EB051901zbMATH Open0823.73078OpenAlexW2039257658MaRDI QIDQ4835974

G. Hobler, R. Slehobr

Publication date: 5 July 1995

Published in: COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1108/eb051901

zbMATH Keywords

analytical solutionrectangular parallelepipedic trench

Mathematics Subject Classification ID

Linear elasticity with initial stresses (74B10) Composite and mixture properties (74E30)

Cites Work

• Nuclei of Strain in the Semi-Infinite Solid
• Thermoelastic Stress in the Semi-Infinite Solid
• Title not available (Why is that?)

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