The effect of material anisotropy on the mechanics of a thin-film/substrate system under mechanical and thermal loads

DOI10.1177/10812865211031277OpenAlexW3184014910MaRDI QIDQ5041555

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Publication date: 14 October 2022

Published in: Mathematics and Mechanics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1177/10812865211031277

zbMATH Keywords

finite element analysissingular integral equationthin filmsthermal loadingfilm stresses

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

Related Items (1)

Antiplane deformation of an orthotropic layer due to surface loads

Cites Work

• Edge delamination in an orthotropic bimaterial consisting of a thin film and a substrate
• Wedge indentation of a thin film on a substrate based on micromorphic plasticity
• The edge cracking and decohesion of thin films
• Cracking of an orthotropic substrate reinforced by an orthotropic plate.
• Brittle detachment of a stiffener bonded to an elastic plate
• A coupled FE-BIE model for the static analysis of Timoshenko beams bonded to an orthotropic elastic half-plane
• Debonding of FRP and thin films from an elastic half-plane using a coupled FE-BIE model
• Combined effect of pressure and geometric imperfection on buckling of stressed thin films on substrates
• The transverse crack problem for elastic bodies stiffened by thin elastic coating
• Thin Film Materials
• The Problem of an Elastic Stiffener Bonded to a Half Plane

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