Thermoelastic analysis of a cracked orthotropic strip under heat conduction effect of crack interior
From MaRDI portal
Publication:5132457
DOI10.1177/1081286519865951OpenAlexW2965028078MaRDI QIDQ5132457
Unnamed Author, Yuan-Bo Wu, Xian-Ci Zhong
Publication date: 12 November 2020
Published in: Mathematics and Mechanics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1177/1081286519865951
singular integral equationorthotropic stripthermal stress intensity factorcrack initiation behaviorthermal-medium crack model
Cites Work
- Unnamed Item
- Unnamed Item
- Unnamed Item
- Unnamed Item
- Unnamed Item
- Computation of thermal fracture parameters for orthotropic functionally graded materials using \(J_k\)-integral
- Fracture in fully coupled dynamic thermoelasticity
- A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply
- Thermoelasticity
- Effects of thermoelasticity and a von Mises condition in rapid steady-state quasi-brittle fracture
- Thermoelasticity without energy dissipation
- Closed-form solution for a mode-III crack at the mid-plane of a piezoelectric layer
- Soliton-like waves in a low-temperature nonlinear thermoelastic solid
- Thermoelastic field of a transversely isotropic elastic medium containing a penny-shaped crack: exact fundamental solution
- Connections between anisotropic tensors of thermal conductivity and thermal expansion coefficients
- A thermodynamic framework for the modeling of crystallizable triple shape memory polymers
- Thermal stresses due to a uniform heat flow disturbed by a pair of offset parallel cracks in an infinite plane with orthotropy
- Explicit analytical solutions for elastic fields in two imperfectly bonded half-spaces with a thermal inclusion
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
- Simulation of the thermal shock behavior of ultra-high temperature ceramics with the consideration of temperature-dependent crack propagation criterion and interaction between thermal shock cracks evolution and thermal conduction
- A non-local dissipative Lagrangian modelling for generalized thermoelasticity in solids
- Thermoelastic analysis for an opening crack in an orthotropic material
- An extended thermal-medium crack model
- A generalized dynamical theory of thermoelasticity
- Thermoelasticity and Irreversible Thermodynamics
- Transient thermal stress problem in an orthotropic, thin plate with a Griffith crack
- On the Singular Character of Thermal Stresses Near a Crack Tip
- Mixed Mode Cracking in Layered Materials
- Propagation of Discontinuities in Coupled Thermoelastic Problems
This page was built for publication: Thermoelastic analysis of a cracked orthotropic strip under heat conduction effect of crack interior
