Heat transfer in vacuum packaged microelectromechanical system devices

DOI10.1063/1.2832777zbMath1182.76108OpenAlexW2021462895MaRDI QIDQ5303746

Chunpei Cai

Publication date: 18 March 2010

Published in: Physics of Fluids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1063/1.2832777

zbMATH Keywords

heat transfermicromechanical devicesthermal management (packaging)

Mathematics Subject Classification ID

Fluid mechanics (76-XX)

Related Items (3)

A numerical study of the heat transfer through a rarefied gas confined in a microcavity ⋮ Collisionless gas flows. I. Inside arbitrary enclosures ⋮ Free-molecular heat transfer of vibrating cantilever and bridges

Cites Work

• A direct simulation method for subsonic, microscale gas flows
• Gas mixing in microchannels using the direct simulation Monte Carlo method
• Scalar and parallel optimized implementation of the direct simulation Monte Carlo method
• Orifice flow at high Knudsen numbers
• A rarefied gas flow caused by a discontinuous wall temperature
• Enclosure gas flows driven by non-isothermal walls
• Flows Induced by Temperature Fields in a Rarefied Gas and their Ghost Effect on the Behavior of a Gas in the Continuum Limit
• Predicting failure of the continuum fluid equations in transitional hypersonic flows
• Statistical simulation of low-speed rarefied gas flows

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