Automatic identification of spatial defect patterns for semiconductor manufacturing

DOI10.1080/02772240600610822zbMath1128.90465OpenAlexW2005407075MaRDI QIDQ5444442

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Publication date: 25 February 2008

Published in: International Journal of Production Research (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1080/02772240600610822

zbMATH Keywords

pattern recognitionhierarchical clusteringdata miningpartitioning clustering

Mathematics Subject Classification ID

Production models (90B30) Pattern recognition, speech recognition (68T10)

Cites Work

• Unnamed Item
• Monitoring Wafer Map Data from Integrated Circuit Fabrication Processes for Spatially Clustered Defects
• Regularized Gaussian Discriminant Analysis Through Eigenvalue Decomposition
• Wafer bin map recognition using a neural network approach
• Detecting Spatial Effects from Factorial Experiments: An Application from Integrated-Circuit Manufacturing
• On clustering validation techniques

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