Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology
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Publication:552594
DOI10.1016/j.physleta.2007.07.047zbMath1217.80108OpenAlexW2085916061MaRDI QIDQ552594
Shih-Chung Fang, Win-Jin Chang, Yu-Ching Yang, Te-Hua Fang
Publication date: 26 July 2011
Published in: Physics Letters. A (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.physleta.2007.07.047
Cites Work
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- An inverse analysis to estimate linearly temperature dependent thermal conductivity components and heat capacity of an orthotropic medium
- Inverse problem of coupled heat and moisture transport for prediction of moisture distributions in an annular cylinder
- An inverse problem in simultaneously estimating boundary moisture fluxes in a porous annular cylinder
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