Analysis of interfacial thermal stresses of chip-substrate structure

DOI10.1016/S0020-7683(00)00099-8zbMath0984.74024OpenAlexW1978003140WikidataQ127740169 ScholiaQ127740169MaRDI QIDQ5926714

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Publication date: 5 May 2002

Published in: (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(00)00099-8

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