Numerical simulation of grain-boundary grooving by level set method

DOI10.1006/jcph.2001.6760zbMath1112.74457arXivcond-mat/0001449OpenAlexW3105637149MaRDI QIDQ5943861

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Publication date: 3 March 2002

Published in: Journal of Computational Physics (Search for Journal in Brave)

Full work available at URL: https://arxiv.org/abs/cond-mat/0001449

Mathematics Subject Classification ID

Nonlinear parabolic equations (35K55) Stefan problems, phase changes, etc. (80A22) Transformations involving diffusion in solids (74N25) Crystals in solids (74N05)

Related Items (6)

Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces ⋮ Stability and shape evolution of voids and channels due to surface misfit ⋮ Electromigration-driven Evolution of the Surface Morphology and Composition for a Bi-Component Solid Film ⋮ A local semi-implicit level-set method for interface motion ⋮ Finite element method for epitaxial growth with attachment--detachment kinetics. ⋮ A combined compact finite difference scheme for predicting the evolution of a mean curvature driven interface

Cites Work

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• A level set approach for computing solutions to incompressible two-phase flow
• A fast level set method for propagating interfaces
• A variational level set approach to multiphase motion
• High-Order Essentially Nonoscillatory Schemes for Hamilton–Jacobi Equations
• Computation for electromigration in interconnects of microelectronic devices

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