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3-D finite element simulation of wafer thermal distortion and stress fields in exposure process - MaRDI portal

3-D finite element simulation of wafer thermal distortion and stress fields in exposure process

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Publication:5956667

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DOI10.1016/S0017-9310(01)00163-6zbMath0988.74543MaRDI QIDQ5956667

Lin, Zone-Ching, Wen-Jang Wu

Publication date: 22 July 2002

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

zbMATH Keywords

Finite element method Thermal stress Exposure Thermal deformation Wafer

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Thermal effects in solid mechanics (74F05)

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