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Finite element modeling of a microelectronic structure under uniform thermal loading. - MaRDI portal

Finite element modeling of a microelectronic structure under uniform thermal loading.

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Publication:5958742

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DOI10.1016/S0168-874X(01)00077-4zbMath1103.74361OpenAlexW1974415366MaRDI QIDQ5958742

A. F. Okyar, M. Gosz

Publication date: 3 March 2002

Published in: Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0168-874x(01)00077-4

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Thermodynamics in solid mechanics (74A15) Analysis of microstructure in solids (74N15)

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