Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes
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Publication:598097
DOI10.1016/J.IJSOLSTR.2003.09.056zbMath1075.74523OpenAlexW1972729021MaRDI QIDQ598097
Publication date: 6 August 2004
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2003.09.056
Related Items (8)
Modeling method for the crack problem of a functionally graded interfacial zone with arbitrary material properties ⋮ Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory ⋮ Inertia effect analysis of a half‐plane with an induced crack under thermal loading using hyperbolic heat conduction ⋮ Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials ⋮ Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes ⋮ Edge-cracked bimaterial systems under thermal heating ⋮ Anisotropic heat conduction across an interface crack/defect filled with a thin interstitial medium ⋮ Dynamic stress intensity factors for two parallel interface cracks between a nonhomogeneous bonding layer and two dissimilar elastic half-planes subject to an impact load
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