Thermal stressed state of a bimaterial with interface crack filled with a compressible liquid

DOI10.1007/S10958-023-06404-2zbMath1515.74020OpenAlexW4367845733MaRDI QIDQ6044599

Kh. I. Serednytska

Publication date: 22 May 2023

Published in: Journal of Mathematical Sciences (New York) (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10958-023-06404-2

zbMATH Keywords

thermoelasticitythermal resistancenonlinear singular integrodifferential equationmode-II stress intensity factor

Mathematics Subject Classification ID

Brittle fracture (74R10) Fluid-solid interactions (including aero- and hydro-elasticity, porosity, etc.) (74F10) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05)

Cites Work

• Unnamed Item
• Effect of heat-conductive filler of interface gap on thermoelastic contact of solids
• Thermoelastic analysis for an opening crack in an orthotropic material

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