Interfacial behavior of a thermoelectric film bonded to a graded substrate

DOI10.1007/s10483-023-3045-8zbMath1529.74052MaRDI QIDQ6062799

Peijian Chen, Shaohua Chen, Zaixing Huang, Guangjian Peng, Dengke Li, Juan Peng

Publication date: 2 December 2023

Published in: AMM. Applied Mathematics and Mechanics. (English Edition) (Search for Journal in Brave)

zbMATH Keywords

stress intensity factorsingular integral equationthermal conductivitycurrent densityinterfacial failureinterfacial shear stress

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Thin films (74K35)

Cites Work

• Finite element analysis of nonlinear fully coupled thermoelectric materials
• A continuum theory of thermoelectric bodies and effective properties of thermoelectric composites
• Contact mechanics of graded coatings
• The effectiveness of the bonding layer to attain reliable thermoelectric structures
• On coupling contact analysis of thermoelectric materials
• Two-dimensional contact mechanics of functionally graded materials with arbitrary spatial variations of material properties

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