Debonding fracture of bonded bimaterial semi‐strips subjected to concentrated forces and couples

DOI10.1002/ZAMM.201500125OpenAlexW2108347047MaRDI QIDQ6065024

Seiji Kato, Norio Hasebe

Publication date: 11 December 2023

Published in: ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1002/zamm.201500125

zbMATH Keywords

fracturestripstrain energy release rateinterfacedebondingbimaterialfatigueParis lawcomplex stress intensity factorstress intensity of debondingdissimilardebonding fracture

Mathematics Subject Classification ID

Material properties given special treatment (74Exx) Generalities, axiomatics, foundations of continuum mechanics of solids (74Axx) Coupling of solid mechanics with other effects (74Fxx)

Cites Work

• Unnamed Item
• A mixed boundary value problem for debonding of a semielliptic rigid inclusion on the rim of a half plane
• A simple model for the study of the tolerance of interfacial crack under thermal load
• An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction
• Solution of problem of two dissimilar materials bonded at one interface subjected to temperature
• Solution of bonded bimaterial problem of two interfaces subjected to concentrated forces and couples
• Debondings at a Semielliptic Rigid Inclusion on the Rim of a Half Plane

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