Avoiding inelastic strains in solder joint interconnections of space electronics

DOI10.1002/ZAMM.202200097OpenAlexW4308991730MaRDI QIDQ6121027

E. Suhir

Publication date: 26 March 2024

Published in: ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1002/zamm.202200097

Mathematics Subject Classification ID

Generalities, axiomatics, foundations of continuum mechanics of solids (74Axx) Elastic materials (74Bxx) Coupling of solid mechanics with other effects (74Fxx)

Cites Work

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• Adhesively bonded assemblies with identical nondeformable adeherends and `piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive
• Interfacial Stresses in Bimetal Thermostats
• Predicted Thermal Mismatch Stresses in a Cylindrical Bi-material Assembly Adhesively Bonded at Its Ends

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