Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework

DOI10.1016/J.CMA.2023.116183OpenAlexW4381988832MaRDI QIDQ6171232

Sundaram Vinod K. Anicode, Ya-nan Zhang, Xuejun Fan, Erdogan Madenci

Publication date: 11 August 2023

Published in: Computer Methods in Applied Mechanics and Engineering (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.cma.2023.116183

zbMATH Keywords

peridynamicelectromigrationmetal linevoid length

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX) Biology and other natural sciences (92-XX)

Cites Work

• A thermodynamic model for electrical current induced damage
• A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
• A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
• Reformulation of elasticity theory for discontinuities and long-range forces
• Peridynamic least squares minimization
• Bond- and state-based peridynamic analysis in a commercial finite element framework with native elements
• Peridynamic differential operator and its applications
• A unified method to simulate electrodeposition and galvanic corrosion using the peridynamic differential operator
• Peridynamic Differential Operator for Numerical Analysis

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