Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles

DOI10.1016/j.cam.2011.05.018zbMath1300.74031OpenAlexW2066945499MaRDI QIDQ651924

Zhiping Li, Shan Wang

Publication date: 19 December 2011

Published in: Journal of Computational and Applied Mathematics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.cam.2011.05.018

zbMATH Keywords

Chebyshev collocation methodtelephone cord buckleselastic thin filminitial residual stressinterface toughnessvon Kármán plate equations

Mathematics Subject Classification ID

Spectral, collocation and related methods for boundary value problems involving PDEs (65N35) Structured surfaces and interfaces, coexistent phases (74A50) Thin films (74K35)

Cites Work

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• Mathematical modeling and numerical simulation of telephone cord buckles of elastic films
• Collocation methods for the solution of von-Kármán dynamic nonlinear plate systems
• Mixed Mode Cracking in Layered Materials

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