A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects

DOI10.1016/j.euromechsol.2024.105305MaRDI QIDQ6558121

Peizhen Huang, Yuanzhe Guo

Publication date: 18 June 2024

Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)

zbMATH Keywords

finite element methodcrystal orientationelectromigrationmulti-phase-field modelanisotropic surface diffusionmisorientation difference

Mathematics Subject Classification ID

Mechanics of deformable solids (74-XX)

Cites Work

• Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
• A phase field model for the electromigration of intergranular voids
• The Cahn–Hilliard equation with a concentration dependent mobility: motion by minus the Laplacian of the mean curvature
• Free Energy of a Nonuniform System. I. Interfacial Free Energy

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