Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field
DOI10.1016/j.amc.2015.01.102zbMath1410.74025OpenAlexW2018861908MaRDI QIDQ669730
Alvo Aabloo, Flyura Djurabekova, Vahur Zadin, Mihkel Veske, Simon Vigonski
Publication date: 15 March 2019
Published in: Applied Mathematics and Computation (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.amc.2015.01.102
molecular dynamics simulationsfinite element simulationsmultiscale simulationssurface stress modelvoid under copper surface
Electromagnetic effects in solid mechanics (74F15) Composite media; random media in optics and electromagnetic theory (78A48)
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