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Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium

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Publication:675659
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DOI10.1016/0020-7683(95)00008-XzbMath0874.73054OpenAlexW1972130813MaRDI QIDQ675659

M. H. Shen, Ching-Kong Chao

Publication date: 9 March 1997

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/0020-7683(95)00008-x


zbMATH Keywords

singular integral equationscontinuity conditionscomplex potentialthermal stress intensity factorsdislocation functions


Mathematics Subject Classification ID

Lua error in Module:PublicationMSCList at line 37: attempt to index local 'msc_result' (a nil value).


Related Items (5)

Stress intensity factors for bonded two half planes weakened by thermally insulated cracks ⋮ A magnetoelectric screw dislocation interacting with a circular layered inclusion ⋮ Complex potentials and integral equations for curved crack and curved rigid line problems in plane elasticity ⋮ Static equilibrium of a thermoelastic half-plane: Green's functions and solutions in integrals ⋮ Solutions of a crack interacting with a three-phase composite in plane elasticity




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