Analysis of dynamic stress intensity factors for interfacial crack near shallow circular inclusion in bi-material half-space to SH wave

DOI10.1007/S00707-016-1678-2zbMath1380.74014OpenAlexW2488302083MaRDI QIDQ683595

Hui Qi, Jie Yang

Publication date: 8 February 2018

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-016-1678-2

Mathematics Subject Classification ID

Structured surfaces and interfaces, coexistent phases (74A50) Fracture and damage (74R99)

Related Items (2)

Dynamic response of two adjacent semi-cylindrical alluvial inclusions embedded in a bi-material half space surface by SH waves ⋮ Scattering of SH-wave by an elliptical inclusion with partial debonding curve in half-space

Cites Work

• Dynamic analysis for circular inclusions of arbitrary positions near interfacial crack impacted by SH-wave in half-space
• Dynamic anti-plane analysis for two symmetrically interfacial cracks near circular cavity in piezoelectric bi-materials
• Dispersion relations for SH waves propagation in a porous piezoelectric (PZT-PVDF) composite structure
• SH wave propagation in a cylindrically layered piezoelectric structure with initial stress
• Diffraction of SH-Waves by an Edge Crack
• Diffraction of waves and stress intensity factors in a cracked layered composite
• Diffraction of Antiplane Shear Waves by a Finite Crack

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