Analytical solution for Polish-rate decay in chemical--mechanical polishing

DOI10.1007/S10665-010-9369-9zbMath1307.74035OpenAlexW1975465522MaRDI QIDQ718931

Hong Shi, Terry A. Ring

Publication date: 27 September 2011

Published in: Journal of Engineering Mathematics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10665-010-9369-9

zbMATH Keywords

pad asperitypolymer wear

Mathematics Subject Classification ID

Chemical and reactive effects in solid mechanics (74F25) Explicit solutions of dynamical problems in solid mechanics (74H05)

Cites Work

• Mathematical modeling of polish-rate decay in chemical-mechanical polishing
• A theory of pad conditioning for chemical-mechanical polishing

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