Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics

DOI10.1007/S10409-017-0670-YzbMath1391.74082OpenAlexW2619211473MaRDI QIDQ724455

Shuodao Wang, Boya Liu, Zihao Wang, Xian-Hong Meng

Publication date: 26 July 2018

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-017-0670-y

zbMATH Keywords

virtual work principleflexible electronicsstickup statethird-order polynomials

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

Cites Work

• On asymptotic expansions for the sixth-order linear theory problem of transverse bending of orthotropic elastic plates
• Large deflection analysis of laminated composite plates
• Transcendence of certain trigonometric series
• A Simple Higher-Order Theory for Laminated Composite Plates
• An Improved Shear-Deformation Theory for Moderately Thick Multilayered Anisotropic Shells and Plates
• A High-Order Theory of Plate Deformation—Part 1: Homogeneous Plates
• Zigzag theory for composite laminates

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