Interface crack problem of functionally graded piezoelectric materials: effects of the position of electromechanical impact and gradient

DOI10.1007/s00707-008-0108-5zbMath1172.74046OpenAlexW2094691471MaRDI QIDQ731495

Lee, Kang Yong, Xu-Long Peng, Xian-fang Li

Publication date: 8 October 2009

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-008-0108-5

zbMATH Keywords

singular integral equationsdynamic stress intensity factorintegral transform method

Mathematics Subject Classification ID

Singularities, blow-up, stress concentrations for dynamical problems in solid mechanics (74H35) Brittle fracture (74R10) Inhomogeneity in solid mechanics (74E05) Electromagnetic effects in solid mechanics (74F15)

Related Items (1)

An interface crack in a functionally graded piezoelectric bi-layer under anti-plane shear impact

Cites Work

• Dynamic behavior of a piezoelectric ceramic layer with two surface cracks
• A homogeneous elliptical shaft may not warp under torsion
• Transient anti-plane crack problem for two bonded functionally graded piezoelectric materials
• Dynamic response of a cracked piezoelectric ceramic under arbitrary electro-mechanical impact
• Dynamic response of a crack in a functionally graded interface of two dissimilar piezoelectric half-planes
• A mode III crack in functionally graded piezoelectric materials
• An anti-plane propagating crack in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric strip
• Transient response of a piezoelectric ceramic strip with an eccentric crack under electromechanical impacts.
• Effect of electromechanical coupling on the dynamic interaction of cracks in piezoelectric materials
• Electrically driven cracks in piezoelectric ceramics: Experiments and fracture mechanics analysis
• A moving mode-III crack in functionally graded piezoelectric material: Permeable problem
• Antiplane Crack Problem in Functionally Graded Piezoelectric Materials
• A Cracked Piezoelectric Material Strip Under Transient Thermal Loading
• The Crack Problem for Bonded Nonhomogeneous Materials Under Antiplane Shear Loading
• Numerical Inversion of Laplace Transforms Using a Fourier Series Approximation
• Yoffe–type moving crack in a functionally graded piezoelectric material

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