Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

DOI10.1016/J.IJSOLSTR.2007.09.007zbMath1167.74406OpenAlexW1984806010MaRDI QIDQ833964

Tarik Omer Ogurtani, Oncu Akyildiz

Publication date: 14 August 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2007.09.007

zbMATH Keywords

surface diffusioncomputer simulationscathode driftelectromigrationgrain boundary groovingmodels of non-equilibrium phenomenasurface morphology

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

Related Items (1)

Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

Cites Work

• Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
• Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
• Numerical simulation of grain-boundary grooving by level set method

This page was built for publication: Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces